A trace drawn with the conductive ink will combine with solder, provided the soldering temperature does not exceed 350 °F (177 °C) and the solder joint is formed within 5 seconds. If the drawn trace must be soldered to, we recommend tin/lead solder containing 2% silver and that the trace is heat-cured at 150 °F (66 °C) for five minutes to produce the most durable trace possible.

Jason NN, Shen W, Cheng W (2015) Copper nanowires as conductive ink for low-cost draw-on electronics. ACS Appl Mater Interfaces 7:16760–16766. https://doi.org/10.1021/acsami.5b04522 Nuntawong N, Limwichean S, Horprathum M, Patthanasettakul V, Ketkong A, Thamaphat K, Petchruangrong P, Jankong S, Kasikijwiwat P, Chindaudom P, Eiamchai P (2020) Improved discrimination of pen inks on document by surface-enhanced Raman substrate fabricated by magnetron sputtering. Optik 201:163499. https://doi.org/10.1016/j.ijleo.2019.163499 Board manufacturers, wishing to improve the appearance of the boards, need a material that can easily repair any chips or scratches in the permanent resist coating, improving the appearance of the finished board. Chemtronics offers two solutions: CircuitWorks Overcoat Pens and CircuitWorks Epoxy Overcoat. In the case of metal screen and wire mesh, it is important that the holes in the screen or mesh are significantly smaller than the wavelength of the electromagnetic radiation being kept out. The goal of such mesh designs is to maintain a consistent hole pattern with a conductive material to ensure electrical continuity. Such a mesh can be repaired by restoring the hole pattern using polyimide tape and CircuitWorks Conductive Paint. Low-voltage Electronics: Conductive pens are suitable for low-voltage applications, such as wearable electronics, simple sensors, touch-sensitive interfaces, and other electronic projects that don't involve high power or high-frequency signals.

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Fig. 4 (a) TEM image of the silver nanoparticles, (b) the SAED patterns, and (c) the high-resolution TEM image. A. K. Michael Grouchko, C. F. Mihailescu, D. F. Anghel and S. Magdassi, ACS Nano, 2011, 5, 6 Search PubMed.

Each Circuit Scribe pen is hand filled with a water-based, non-toxic, silver ink. The ink lasts approximately 196-260 feet worth of lines before running dry. The lifetime of the trace lines is still being determined; however, trace lines drawn three years ago still function according to Eletroniks Incorporated. CircuitWorks ® Conductive Pens make instant highly conductive silver traces on circuit boards and are used in prototype , rework, and repair of circuit boards by linking components, repairing defective traces, making smooth jumpers. The silver traces of the circuit pen dry in minutes and have excellent adhesion to most electronic materials. Engineers, repair technicians, and manufacturers will find that the CircuitWorks ® Conductive Circuit Pen speeds project completion and cuts rework time. Sharma V, Kumar R (2017) Dating of ballpoint pen writing inks via spectroscopic and multiple linear regression analysis: a novel approach. Microchem J 134:104–113. https://doi.org/10.1016/j.microc.2017.05.014 For optimal adhesion to most surfaces, clean the repair area prior to ink application. That ensures the surface is free of oil, grease and handling soils. Rahim MA, Centurion F, Han J, Abbasi R, Mayyas M, Sun J, Christoe MJ, Esrafilzadeh D, Allioux FM, Ghasemian MB, Yang J, Tang J, Daeneke T, Mettu S, Zhang J, Uddin MH, Jalili R, Kalantar-Zadeh K (2020) Polyphenol-induced adhesive liquid metal inks for substrate-independent direct pen writing. Adv Func Mater 31:2007336. https://doi.org/10.1002/adfm.202007336Morgan ML, Curtis DJ, Deganello D (2019) Control of morphological and electrical properties of flexographic printed electronics through tailored ink rheology. Org Electron 73:212–218. https://doi.org/10.1016/j.orgel.2019.05.027 This is a rollerball pen that writes with conductive silver ink. It makes creating circuits as easy as doodling. The straw attachment that comes with aerosol flux removers is a good way to increase the spray force and penetrate beneath components. K. M. M. Abou El-Nour, A. a. Eftaiha, A. Al-Warthan and R. A. A. Ammar, Arabian J. Chem., 2010, 3, 135–140 CrossRef CAS.