ARCTIC MX-6 (4 g) - Ultimate Performance Thermal Paste for CPU, consoles, graphics cards, laptops, very high thermal conductivity, long durability, non-conductive, non-capacitive

£3.745
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ARCTIC MX-6 (4 g) - Ultimate Performance Thermal Paste for CPU, consoles, graphics cards, laptops, very high thermal conductivity, long durability, non-conductive, non-capacitive

ARCTIC MX-6 (4 g) - Ultimate Performance Thermal Paste for CPU, consoles, graphics cards, laptops, very high thermal conductivity, long durability, non-conductive, non-capacitive

RRP: £7.49
Price: £3.745
£3.745 FREE Shipping

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Description

MX Cleaner is a 100% biodegradable wipe to clean the surface of CPU and other chips for easy and complete removal of the thermal paste and its residue. Each wipe is provided in a separate sealed container to ensure a longer shelf life. Liquid metal offers the best performance compared to any thermal paste out there, and the Thermal Grizzly Conductonaut proves that with its rated thermal conductivity of 73 W/mk. It has the potential of reducing temperatures by over 10 degrees Celsius in certain cases. The incredible performance of this liquid metal compound comes at a cost, though. Since it is electrically conductive, it can damage parts of your system if you don't apply it properly. PC was powered off for a minimum of 30 minutes after a stress test run. This would allow the completion of the thermal cycle with hot and cold runs giving the thermal paste some time to reach its near-optimal condition. Ideally, we would have wanted to do 3 tests as a minimum for a single thermal paste and show the average of these three runs. I am recovering from a total hip replacement surgery and slowly resuming the testing hence only one test result is used Well, the ARCTIC MX-6 lowers the temperature by 1°C over the Noctua NT-H1. I would hardly declare it as a winner.

Liquid metal compounds make their way to the top of the temperature chart with slightly cooler values than the traditional pastes. Interestingly, the difference between the top and bottom of this chart is less than 4C.

We are proud of our thermal pastes. With over twenty years of experience in the PC cooling market and the goal to offer first-class products at a fair price, we have developed the MX-6. The formula of the new thermal paste is based on the proven MX-4, one of the best-selling thermal pastes in the world. Our focus was both on improving performance and on versatile application possibilities and an easy-to-use consistency. The modus operandi has been the same: spread out a grain of rice with thermal paste, mount a heatsink, leave it on for 20 minutes at rest, Prime95 for 10 minutes, turn off the computer for 10 minutes and, with this, the paste is settled. Then we turn on the PC again and stress the processor with Prime95 for 10 minutes, capturing the maximum temperature that any of the cores has had. For the air cooling low- and high-tension tests, we used a large Noctua NH-D15 air cooler. We created the low tension mount environment by torquing the mounting screws to 1.13 Nm (10 in/lbs).

The dispersion is quite good, denoting that it is not as viscous as it seemed to us in the first instance, especially when we have not applied as much pressure as a heatsink will apply to the processor and, in fact, we have put much more thermal paste on the paper of the which we will cast on the IHS of the processor normally. Artic's Silver series is extremely popular among enthusiasts. The Silver series has also been around for quite some time now and the company has managed to keep it relevant in the space by adding newer, better variants to match the current standards. The Arctic Silver 5 is currently one of the most popular thermal paste solutions on the market. It's a high-density polysynthetic silver compound that's known to be very effective in a variety of builds. It contains micronized silver and several other thermally conductive ceramic particles to offer a high level of performance and stability.As you can see, the Arctic MX-6 is the winner of this comparison, taking 0.7 degrees from the excellent Noctua NT-H2 and 1.9 degrees Celsius from the CORSAIR TM30, which is not bad thermal paste either. Of course, in terms of performance, it seems that Arctic has done an excellent job again.

You may have heard of thermal pads being used by many as a replacement for thermal paste. That's entirely normal because thermal pads are also highly efficient. Thermal pads are primarily used on M.2 SSD modules. As such the heatsink or the motherboard shroud covering the M.2 SSD module holds thermal pads to dissipate the heat produced by the modules. It works the same way as thermal paste, except these are solid pads as opposed to pasting or liquid solutions. We think the Thermal Grizzly's Carbonaut is one of the best options on the market. This can be used on both processors and GPUs too. The application of thermal pads involves placing the pad on top of the CPU IHS, thereby filling the gap between the IHS and the heatsink. A graphics card with a much higher heat load or the HEDT/EPYC CPUs with large surface areas are better candidates for thermal paste testing. It’s no surprise that the liquid metal compounds once again sit atop the thermal comparison. Still, a 6C difference between all 15 thermal compounds tested shows there isn’t a lot of variation, even with a 360 all-in-one cooler with a push+pull fan setup for performance.The XTM50 paste by itself has low viscosity, so can also just use the 'Dot method' to apply the paste and let the mounting pressure do its thing. But if you're too worried about applying using that method, then the bundled stencil and spreader make it very easy to get things done. In theory, you can use any application method for a compound with low viscosity, but the stencil makes it that much easier to apply. It's for new builders who don't necessarily have the technical know-how of properly applying thermal paste and how improper application can have a lasting impact on the overall performance of the CPU. Now coming to the main point of this article, the following configuration is used for thermal paste testing: – Please note that not every run of the stress test may yield the same result. This could well be due to many factors like mounting pressure, thermal paste application, and varying ambient temperature. Not to mention the silicon differences even among the same category of chips. Hence, it is pertinent to mention the testing methodology along with the specifics. Each time the even spread of the thermal paste was verified and where the thermal paste spread was not even or gives the impression of a tear or a poor application, the result was dropped and the new test with correct spread was repeated. This is done to ensure the validity of the data.



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